CPV: 31712116
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Supply And Installation Of A Multi-Purpose Chip Bonding System And Advanced Materials Dispenser. Funded By The European Union - Nextgenerationeu Through The Recovery And Resilience Facility. Scientific Project Code: (Micronanofabs_Phase 2)-Icts-Mrr-2024-04-Csic Destined For The Barcelona Institute Of Microelectronics (Imb-Cnm)
Acheteur : Secretaría General de la Agencia Estatal Consejo Superior de Investigaciones Científicas
Create/Change Date : 2026-03-23 21:23:54 Pays : [Spain]
Date limite : 2026-04-08 00:00:00 Type : Invitation for Bids
Langue originale : Spanish
Valeur estimée : 170000 EUR View Details
Single Party Framework Agreement Relating To The Supply, Delivery And Commissioning Of Life Sciences Equipment For The Cork Education And Training Board
Acheteur : Cork Education and Training Board
Create/Change Date : 2026-03-04 08:24:16 Pays : [Ireland]
Date limite : 2026-04-03 00:00:00 Type : Invitation for Bids
Langue originale : English
Valeur estimée : 500000 EUR View Details
Indicative Periodic Opinion
Acheteur : SNCF Réseau SA
Create/Change Date : 2025-06-06 10:44:11 Pays : [France]
Date limite : 2026-06-06 00:00:00 Type : Procurement Plan
Langue originale : French
Valeur estimée : 0 EUR View Details